Intel i7-7740X, Core. Processor family: Intel® Core™ i7 X-series, Processor frequency: 4.3 GHz, Processor socket: LGA 2066. Memory channels: Dual, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM. Thermal Design Power (TDP): 112 W. PCI Express configurations: 1x16,1x8+2x4,2x8, Supported instruction sets: AVX 2.0,SSE4.1,SSE4.2, Scalability: 1S. Maximum internal memory: 65536 MB
ProcessorProcessor familyIntel® Core™ i7 X-series
Processor frequency4.3 GHz
Processor cores4
Processor socketLGA 2066
Component forPC
Processor lithography14 nm
BoxY
Cooler includedN
Processor modeli7-7740X
Processor threads8
System bus rate8 GT/s
Processor operating modes64-bit
Processor cache8 MB
Processor cache typeSmart Cache
Processor boost frequency4.5 GHz
Bus typeDMI3
Processor codenameKaby Lake
Processor ARK ID121499
Generation7th Generation
MemoryMemory channelsDual
Maximum internal memory supported by processor64 GB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2666 MHz
ECCN
PowerThermal Design Power (TDP)112 W
Operational conditionsTjunction100 °C
Technical detailsProcessor cache8192 KB
Product typeProcessor
Bus bandwidth8
Bus type unitsGT/s
Launch dateQ2'17
StatusDiscontinued
Maximum memory64 GB
Processor brand nameIntel Core i7 X-series\nIntel Core i7 X-series processor
Last change63903513
Product familyIntel Core Processors
Bus speed8 GT/s
Other featuresMaximum internal memory65536 MB
GraphicsOn-board graphics adapterN
Processor special featuresIntel® Hyper Threading Technology (Intel® HT Technology)Y
Intel® Turbo Boost Technology2.0
Intel® AES New Instructions (Intel® AES-NI)Y
Intel 64Y
Intel Virtualization Technology (VT-x)Y
Intel Virtualization Technology for Directed I/O (VT-d)Y
Conflict-Free processorY
Intel® Optane™ Memory ReadyY
Virtual Reality (VR) readyY
FeaturesMaximum number of PCI Express lanes16
PCI Express slots version3.0
PCI Express configurations1x16,1x8+2x4,2x8
Supported instruction setsAVX 2.0,SSE4.1,SSE4.2
Scalability1S
CPU configuration (max)1
Embedded options availableN
Thermal solution specificationPCG 2017X
PCI Express CEM revision3.0
Market segmentDT
Harmonized System (HS) code8542310001
